The new flexible Polydrop polyurethane resin T825s with K865s hardener comes as a substitute for the previous T825 / K865 product kit. It is a high-quality doming resin that brings excellent results after application and drying. The resin/ hardener kit comes in 1000 ml each cans. It remains clear and transparent after a long time following its production. Works well on eco-solvent inks prints.
Important guidance
Please follow strictly the listed instructions when using Polydrop polyurethane resin T825s with K865s hardener!
Store spare cans, cartons, or pallets at ambient temperature.
- If you do not use the oven, have at least 26/27° during the working time. Work in an air-conditioned environment, at maximal humidity of 50%. Cans storage should be at optimal conditions, also for the mixture of T825S resin and K865S hardener.
- Use mixer equipment for best results and in order to avoid bubbling. Mix resin and hardener with Vacuum Poly Mix C80 for 5 minutes.
- For the drying of the T825s resin, we recommend using a drying cabinet oven for 4 hours at 35/ 40°C. Do overheat or exceed the temperature of 40°C.
- Drying can also take place in about 24h at least 27°C The mixed doming resin does not dry at 22°C or below. Actually, the best results with beautiful and ideal at-touch surfaces get developed by using the oven at 40°C.
Mixing ratio and usage time
Here, you can’t add more hardener as you could with the resin T825/K865. Therefore, use only the 1:1 ratio exclusively.
Using time (with doming resin dispenser + syringe) about 25- 30 minutes at 26/ 27°C.
The processing time depends on the amount of product used, more product = less processing time.
Resin T825s and hardener K865s are not compatible with any other leftovers of previous Polydrop supplies with different reference codes, including T825 resin / K865 hardener.
With regard to the above considerations, it is strongly recommended to perform tests with the doming resin T826S / K865S hardener before starting a production process. Please read the T825S doming resin application guidelines in the linked file.
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